A technical paper titled “AutoCRAFT: Layout Automation for Custom Circuits in Advanced FinFET Technologies” was published by researchers at UT Austin and NVIDIA. “This paper presents AutoCRAFT, an ...
IC Compiler II and Design Compiler Graphical provide a complete digital implementation flow delivering optimized power, performance, area, and full via pillar support StarRC, PrimeTime, NanoTime, and ...
As the semiconductor industry transitions to finFETs, reliability challenges are increasing. ESD designers are challenged with new issues that would require significant rethinking and redesign of ...
Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced delivery of a comprehensive design ...
As the digital semiconductor manufacturing process moves into the FinFET era, more and more front-end-of-line (FEOL) defects are observed due to extremely small feature size and complex manufacturing ...
High-Speed Serializer/Deserializer (SerDes) technology addresses these challenges by enabling efficient communication over ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced its digital and custom/analog flows are certified on the Intel 16 FinFET process technology and its ...
Researchers are making progress in developing new types of transistors, called finFETs, which use a finlike structure instead of the conventional flat design, possibly enabling engineers to create ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ:CDNS) today announced its continued collaboration with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process ...
HSINCHU, Taiwan — United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the release of its 14nm embedded high-voltage (eHV) ...
Over the past couple of days there have been a string of press releases related to the tape-out of a test chip from Samsung at 14nm using FinFETs. This is a condensation of those releases from Samsung ...