Researchers began working on 3D integrated circuits almost two decades ago. In the first efforts, each stack, which contained a device layer and multiple interconnect layers, was fabricated separately ...

Global goods trade expanded in 2025, supported by strong demand for AI related products, relatively low shipping costs, and the ability of global value chains to adapt through trade diversion and ...

Traditional single-cell models often overlook the proteomic context of cell phenotypes. Here, authors present CAPTAIN, a multimodal foundation model pretrained on 4.2 million cells. It aligns RNA and ...

Abstract: State-of-the-art silicon interposer technology of chip-on-wafer-on-substrate (CoWoS) containing the second-generation high bandwidth memory (HBM) has been applied for the first time in ...

Abstract: The rapid advancement of artificial intelligence (AI) has been enabled by semiconductor-based electronics. However, the conventional methods of transistor scaling are not enough to meet the ...

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